PURPOSE: An etching composition is provided to improve storage stability and process margin and to form a metal pattern with a stable taper-shaped profile. CONSTITUTION: An etching composition of a copper-based metal film comprises 0.1-30 wt% of ammonium peroxodisulfate, 0.1-10 wt% of a sulphate, 0.01-5 wt% of an acetic acid salt, and 55-99.79 wt% of water. A forming method of a meal patter comprises a step of forming a copper-manganese alloy layer(126) on a substrate(110)

An etching composition and a method of manufacturing a display substrate using the etching composition are disclosed. The etching composition includes phosphoric acid (H3PO4) of about 40% by weight to about 70% by weight, nitric acid (HNO3) of about 5% by weight to about 15% by weight, acetic acid (CH3COOH) of about 5% by weight to about 20% by weight, and a remainder of water. Thus, a metal layer including copper may be stably etched.

PROBLEM TO BE SOLVED: To provide a heat radiation sheet which has excellent heat conductivity, can be recycled, does not contain a low molecular weight compound causing contact failure and the like of an electric circuit and suitably adheres to an exothermic member, a cooling member and the like.

One disclosed embodiment concerns an aqueous inorganic coating precursor solution comprising a mixture of water, polynuclear aluminum hydroxide cations, and polyatomic ligands selected from nitrate (NO3-), nitrite (NO2-), or combinations thereof. In certain embodiments, the composition has a molar concentration ratio of polyatomic ligands to aluminum of less than 3

The present invention relates to a high thermal conductivity composite material which is a metal-based thermal interface material having a high thermal conductivity and is suitable for element bonding between thermal conductive routes in an electronic heat dissipation device. The high thermal conductivity composite material contains an active soldering alloy and an inorganic high thermal conductive substrate. The active soldering alloy contains at least an alloy substrate and an active element. ...