PROBLEM TO BE SOLVED: To provide a polishing solution which can improve a polishing speed of a film to be polished and improve surface flatness after polishing in a CMP technology for flattening an interlayer insulation film and the film to be polished such as a BPSG film, an STI film, and the like.

PROBLEM TO BE SOLVED: To provide an adhesive for connecting a circuit having rapid curability at low temperature, comprising a composition of practical storage stability, free from corrosion of a metal substrate of an adherend, and a circuit electrode constituted of metal and an inorganic material, and preventing reliability from getting low

PROBLEM TO BE SOLVED: To prvide a thixotropic liquid insulating vanish, which simultaneously satisfies the adherence to rectangular wire edges and the like and the sufficient permeability even to narrow sites such as joint parts, is excellent in adhesivenes, preservation stability, and thermal deterioration resistance, generates little of volatile components to protect the working environment, exhibits a good yield, can be adhered with little of residual air bubbles, and has the hiding property ...

PROBLEM TO BE SOLVED: To provide an adhesive composition transferable to a circuit member in a short time, and having a sufficiently long pot life, and a circuit connection structure and a semiconductor device using the adhesive composition.